How-to

Guides

Practical protocols for going from mold to bonded device with OSTEMER resins. Need help adapting a process? Contact us for technical support.

Prototyping lab-on-chip devices

UV-cast a chip layer in minutes, then heat-cure to stiffen and bond it — no glue, adhesives or plasma.

Make series of identical chips with lab-scale reaction injection molding (RIM) and short UV cycle times.

Cast tube connectors and wells in OSTEMER and bond them to almost any chip during the heat cure.