Prototyping lab-on-chip devices

UV-cast a chip layer in minutes, then heat-cure to stiffen and bond it — no glue, adhesives or plasma.

OSTEMER 322 Crystal Clear makes it possible to rapidly prototype complex lab-on-chip devices thanks to its two-stage cure: the liquid resin is first UV-molded into a microstructured chip layer, then thermally cured to stiffen and bond to most substrates. Filters, membranes and electrodes are easily integrated along the way — no glue, adhesives or plasma treatment needed.

1. Mixing

Mixing the two OSTEMER components and letting bubbles escapeABComponents A + Bratio as stated on the bottlesMix in a light-protected cupstir until uniformLet standbubbles rise out

Mix the two components in the proportions stated on the bottles, in a light-protected container. Let the mixture stand for a few minutes so bubbles can escape.

2. Casting and UV cure

Casting: pour and cover with liner, UV cure, demold and align to a substrate, heat cure to bond1Pour & coverPET release liner on topUV 365 nm2UV cure~60 s Hg lamp · ≥10 mW/cm² LED3Demold & alignclean glass, silicon or metaloven 90–110 °C4Heat cure & bond60–120 min, closed channels

Casting is a quick way to prototype in the lab. The mixed resin can be UV-cast in, and releases from, most mold types — silicones such as PDMS, milled aluminum, or Teflon-coated silicon and SU-8 masters.

  1. 1Pour the mixed resin onto the mold and cover it with a release liner. We have found that 3M Scotchpak 9742 PET liner has the right surface energy to release the chip easily from the mold and make it easy to handle. Other PET liners work too.
  2. 2UV-cure. A standard mercury mask-aligner lamp needs about 60 seconds for a complete cure. With an LED lamp, use 365 nm and make sure it delivers at least 10 mW/cm² at 365 nm.
  3. 3Demold, then align the chip to its substrate. When bonding to glass, silicon or metal, make sure the surface is clean.

3. Heat cure and bond

Cure in an oven at 90–110 °C for 60–120 minutes. That is usually enough to completely cure and bond most designs a few millimetres thick.

Note: Let the device cool down to room temperature before testing it.

Properties suited to lab-on-chip

  • Dual cure with dry bonding using epoxy chemistry
  • Minimal absorption of small molecules
  • Minimal swelling in common solvents
  • Nano- to microscale replication
  • Optically clear with low autofluorescence
  • Mechanically stiff

Recommended for this process

Selected published articles

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