Prototyping with OSTEMER

OSTEMER Crystal Clear resins make it possible to rapidly prototype complex lab-on-chip thanks to the two-stage curing mechanism where the liquid resin is first UV-molded into a micro-structured chip layer and then thermally cured to stiffen and bond to most substrates. Many different types of materials can also be easily integrated: filters, membranes, electrodes. No need for glue, adhesives or plasma treatment. OSTEMER Flex also enables micro patterned flexible components to be integrated on the chip.



Mix the two components of the OSTEMER according to the proportions on the bottles in a light protected container and let stand for a few minutues to remove bubbles.



Casting OSTEMER is a good way for rapid prototyping in the lab. The mixed resin can be UV-casted and releases from most types of molds including silicones like PDMS, milled aluminum or Teflon-coated silicon/SU8 masters.

Pour the mixed resin on the mold and apply a release liner. We have found that Scotchpak 9742 PET liner from 3M has the right surface energy to easy remove the OSTEMER chip from the mold and facilitate handling. Other PET liners will work too. A standard Hg mask aligner lamp will require about 60 seconds for a complete UV-cure. If you use LED UV lamp, use 365 nm and make sure your lamp can give at least 10 mW/cm2 at 365 nm. After UV-cure demold, align to a substrate (if bonding to glass, silico or a metal, make sure it is clean) and heat cure in an oven. A temperature of 90-110 °C for 60-120 min is usually enough to completely cure and bond most designs that are a few mm thick. Wait until the device has cooled down before testing.

Properties adapted for lab-on-chip

Selection of published articles